Products

CTE matching between different materials improves reliability and reduces stress on the chip

Ceramic provides hermetic sealing to protect IC from the external environment.

Mechanical/thermal advantages enhance reliability, promote miniaturization, and improve sensing accuracy.

Thermally conductive ceramic dissipates heat from the IC.

CTE matching between different materials improves reliability and reduces stress on the chip

Metal heat-spreader brazed to ceramic enhances heat dissipation further.

Improves assembly flexibility with IC spacing and wire-bonding shelf.

Ceramic generates little or no dust, reducing dust-related failures.

Thermally conductive ceramic dissipates heat from the IC.

Metal heat-spreader brazed to ceramic enhances heat dissipation further.

CTE matching between different materials improves reliability and reduces stress on the chip

Prevents chip-level packaging failure; improves board-level solder reliability.

Mechanical/thermal advantages enhance reliability, promote miniaturization, and improve sensing accuracy.

CTE matching between different materials improves reliability and reduces stress on the chip

Mechanical/thermal advantages enhance reliability, promote miniaturization, and improve sensing accuracy.

Packages can be designed for specific mounting requirements, including leads for high-strength attachment or pads for surface mounting.

Prevents chip-level packaging failure; improves board-level solder reliability.

Reliability testing proves ceramic’s advantages in protecting ICs through environmental isolation.

Ceramic provides hermetic sealing to protect IC from the external environment.

Packages can be designed for specific mounting requirements, including leads for high-strength attachment or pads for surface mounting.

High-strength materials and better process technologies allow further package miniaturization

Low profile is realized through the development of high-strength materials and improvements in processing.

Mechanical/thermal advantages enhance reliability, promote miniaturization, and improve sensing accuracy.

Ceramic allows customized structures, such as miniaturized multi-chip modules.

Packages can be designed for specific mounting requirements, including leads for high-strength attachment or pads for surface mounting.

Package structure can be designed to optimize chip-level assembly.

Ceramics allow screw mounting holes.

Kyocera offers large ceramic substrates (up to 320mm).

Mechanical/thermal advantages enhance reliability, promote miniaturization, and improve sensing accuracy.

CTE matching between different materials improves reliability and reduces stress on the chip

Kyocera offers LTCC materials suitable for high-frequency applications.

Kyocera supports the total design solution, including peripheral material (FPC/PCB) transition designs.

Ceramic packages have higher heat resistance, allowing the use of high-temperature adhesive materials.

Improves assembly flexibility with IC spacing and wire-bonding shelf.

Various packaging options for shipping are available to utilize existing customer assembly lines.