Challenge: Reducing Substrate Dust Emission
Microelectronic devices are extremely sensitive to contaminants, including dust particles, which can degrade performance and cause device failure. Consequently, materials used to package semiconductor devices must exhibit minimal dust emission. This characteristic makes ceramics preferred over organic materials in critical packaging applications.
Substrate Dust Emissions: Ceramic vs. Organic
Test Method
- Prepare 800ml of DI water in a beaker
- Perform ultrasonic cleaning (3 min.) and measure water's particle count
- Place substrate in a beaker and repeat ultrasonic cleaning (3 min)
- Measure the water's particle count
- Calculate the difference between both counts
⇒Ceramics are virtually dust-free compared to organic materials
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