Key Technologies Supporting Innovation
Kyocera offers a wide range of proprietary materials and process technologies. By combining multiple technologies, we create unique solutions to satisfy your most demanding microelectronic packaging requirements.
Thin-Film Technology
Ceramic Package Features and Basic Structure
Wiring Technology: (Thick / Thin Film)
Integrated Simulation Capabilities
Material Options
Bonding Dissimilar Materials
Offering a Wide Variety of Package Designs and Structures
Co-Firing Technology
Plating Technologies for Multilayer Ceramic Packages
3D Structures / 3D Electrical Interconnects
Customized Optical Window Lid Design
