Technology for Bonding Metals to Ceramics
Kyocera develops advanced technologies to bond ceramics and metals using brazing materials and glass.
This bonding technology is used to attach pins and leads for board-level assembly, seal rings to enable hermetic sealing, and heat-spreader metals to enhance thermal dissipation.
Why Bond Dissimilar Materials ?
- To support multiple board-level assembly options
- To enable hermetic sealing via seam welding
- To improve heat dissipation via heat spreader
Brazing Metals
When packages require hermetic sealing, Kyocera conducts hermeticity testing after brazing to confirm before shipping.
Glass Sealing
Low-dielectric-constant glass serves as a bonding material to support high-frequency applications.
Other Key Technologies Supporting Innovation
Thin-Film Technology
Ceramic Package Features and Basic Structure
Wiring Technology: (Thick / Thin Film)
Integrated Simulation Capabilities
Material Options
Offering a Wide Variety of Package Designs and Structures
Co-Firing Technology
Plating Technologies for Multilayer Ceramic Packages
3D Structures / 3D Electrical Interconnects
Customized Optical Window Lid Design