Standard Packages / Lids

Kyocera offers a large lineup of ceramic packages and lids as standard (open tool) products. These solutions can help you avoid tooling costs and custom design time, and are ideal for device evaluation or prototype-volume production.

Packages

Insertion Mount

C-DIP (Ceramic Dual Inline Packages)
Standard Parts List

C-PGA (Ceramic Pin Grid Array Packages)
Standard Parts List

Surface Mount

Leaded

C-SOP (Ceramic Small Outline Packages)
Standard Parts List

C-QFP (Ceramic Quad Flat Packages)
Standard Parts List

CERQUAD^®Packages
Standard Parts List

C-QFJ(Ceramic Quad Flat J-Leaded Packages)
Standard Parts List

Flat Packages
Standard Parts List

Leadless

C-QFN
(Ceramic Quad Flat Non-Leaded Packages)
Standard Parts List

SMD (Surface Mount Device) Packages
Standard Parts List

LGA (Land Grid Array)
Standard Parts List

Standard Products by Applications

Packages for Optical / Wireless Communications

RF-VIA Packages
Standard Parts List

TO-CAN Packages
Standard Parts List

BTF PKG^®
Standard Parts List

Packages for LEDs/LDs

LED Packages
Standard Parts List

Submounts
Standard Parts List

Package for Power Devices

TO-Packages
Standard Parts List

Lids with different sealing materials

Ceramic Lids with B-stage Epoxy
Standard Parts List

Ceramic Lids with Sealing Glass Material
Standard Parts List

Lids Without Sealing Material
Standard Parts List