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Research and Education
See below for ceramic packages and lids used in research and education applications.
Standard Packages / Lids
Fiber Optic Cannulas (for Optogenetics / Photometry)
Hermetic Glass-Feedthrough Connectors (For Vacuum Equipment)
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Others
Low Electrical Loss
This page introduces LTCC materials with excellent high-frequency characteristics, along with Kyocera's design support services.
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Ceramic Package Miniaturization
Miniaturization is achieved through the development of high-strength materials and improvements in processing technologies.
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Hermetic Sealing
This page provides an overview of hermetic sealing technologies for protecting components from the external environments.
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High Thermally Conductive Ceramics
By using materials with high thermal conductivity, heat generated by components is effectively dissipated.
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Matching Coefficients of Thermal Expansion
By considering the thermal expansion coefficient matching between different materials, we contribute to improved device reliability and stress relief for components.
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