Ceramic Packages

Aluminum Nitride (AlN)

Aluminum Nitride (AlN)

Aluminum Nitride (AlN) is a ceramic material with very strong properties of thermal conductivity and electrical insulation resistance. AlN is used for components that generate high levels of heat, such as LEDs and lasers.

Features

  • Material Properties
    • Higher thermal conductivity (150W/(m・K) or higher)
    • Higher flexural strength
    • Coefficient of thermal expansion closer to silicon
    • Low dust emission
  • Design Flexibility
    • Multilayer structure
    • Thin-film options on polished surface
    • Metal bonding (brazing)
  • Hermetic Sealing Options

High Thermal Conductivity: Aluminum Nitride

Comparison of thermal conductivity simulations among ceramic materials

simulation_model

Typical Applications

Material Properties

Material Name AN242 AN276 AlN170 AlN200 AlN230
Color Black Light Gray Gray Gray Gray
Laminating Structure Applicable Applicable Not applicable Not applicable Not applicable
Dissimilar Material Bonding Applicable Not applicable Not applicable Not applicable Not applicable
Characteristics High Thermal Conductivity
Applications High heat-generating devices (light sources, optical communications)
Electrical
Characteristics
Dielectric Constant 1MHz 8.7 8.8 8.5 8.5 8.5
2GHz 8.6 8.6 - - -
Dielectric
Loss Tangent
(x1.0E-4)
1MHz 1 1 3 3 3
2GHz 170 - - - -
Thermal
Characteristics
CTE (ppm/K)
(RT~400℃)
4.7 4.8 4.6 4.6 4.6
Thermal Conductivity (W/(m・K)) 150 170 170 190 200
Mechanical
Characteristics
Flexural Strength (MPa) 400 400 450 400 350
Young’s Modulus of Elasticity (GPa) 320 320 320 320 320
Co-Fired Conductor Material W W
Values are typical and may vary by product configuration/manufacturing process.

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