Kyocera's combination of manufacturing methods and materials allows us to create ceramic packages with a wide variety of structures. This page introduces some examples of specialized package shapes.
Miniaturized / Multi-Chip
Thinner Design
Hermetic Sealing
Dual Cavities
Holes / Vent Ports
Island Shapes
Screw Mounting Holes
Fluidic Channels
Vertical Mounting Options
Column Structure
Ceramic Ring + Pin + Metal
The designs shown above are just a few examples. Kyocera can create custom package designs and shapes to suit highly specialized requirements. Please contact us for details.
Other Key Technologies Supporting Innovation
Thin-Film Technology
Ceramic Package Features and Basic Structure
Wiring Technology: (Thick / Thin Film)
Integrated Simulation Capabilities
Material Options
Bonding Dissimilar Materials
Co-Firing Technology
Plating Technologies for Multilayer Ceramic Packages
3D Structures / 3D Electrical Interconnects
Customized Optical Window Lid Design