Ceramic Packages and Lids for Barometric Pressure Sensors
Barometric pressure sensors in smartphones and wearable devices require high sensitivity and water resistance. Ceramics are ideal for packaging pressure sensors due to their lower Coefficient of Thermal Expansion (CTE) and higher rigidity, which help enhance sensitivity. In addition, Kyocera has developed ceramic package concepts offering dust and water resistance using ceramic lids with micro holes.
Features
CTE Closer to Silicon
The simulation below compares the deformation of ceramic and organic substrates near the IC edge over the specified temperature range.
Ceramic substrates reduce deformation at higher temperatures, enhancing device sensitivity.
Higher Rigidity
Ceramic's higher rigidity results in less deformation even when subjected to strong pressure, further enhancing performance.
Concept: Dust- and Water-Resistant Sensor Packages
Ceramic lids can be designed with micro holes (smaller than 100µm in diameter), allowing dust- and water-resistance in barometric pressure sensors.
Please contact us for further information.
