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Ceramic Packages
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Other Consumer Electronics Applications

See below for ceramic packages and lids used in various consumer electronics applications, including home electronics and gaming equipment.

　

Ceramic Packages for Small, Secondary Storage Batteries
Ceramic Packages / Lids for Quartz Crystal Devices
Ceramic Packages / Lids for Imaging sensor
Ceramic Packages for Light Emitting / Sensing Devices
Ceramic Packages and Lids for Barometric Pressure Sensors
Ceramic Packages and Lids for Metal-Oxide Gas Sensors
Ceramic Packages for NDIR Gas Sensors
Ceramic Packages for MEMS Microphones
Microfluidic Packages for Gas-Sensing Devices
RFID Tags
Ceramic Substrates for Plasma Generation
Applications Top Page

Others

Low Electrical Loss
This page introduces LTCC materials with excellent high-frequency characteristics, along with Kyocera's design support services.
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Ceramic Package Miniaturization
Miniaturization is achieved through the development of high-strength materials and improvements in processing technologies.
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Hermetic Sealing
This page provides an overview of hermetic sealing technologies for protecting components from the external environments.
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High Thermally Conductive Ceramics
By using materials with high thermal conductivity, heat generated by components is effectively dissipated.
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Matching Coefficients of Thermal Expansion
By considering the thermal expansion coefficient matching between different materials, we contribute to improved device reliability and stress relief for components.
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