
Ceramic Packages and Lids for Metal-Oxide Gas Sensors

Metal-oxide gas sensors, among the most widely used gas-sensor devices, are designed to detect combustible and/or toxic gases. Their advantages include excellent durability and stable operating performance over a long product lifespan. To promote miniaturization, newer metal-oxide gas sensors incorporate MEMS (micro-electromechanical systems) chips in smaller, thinner packages. Kyocera's multilayer ceramic packages allow three-dimensional circuitry to enable the development of smaller and thinner gas sensors.
Features




Ceramic Packages Allow Smaller, Thinner Devices

• Smaller and thinner package designs possible with 3D circuitry and ceramic's higher mechanical strength
• Customized package designs for your unique requirements
Less Outgas
Package Outgas Comparison: Organic vs. Ceramic

Ceramic packages are helping to bring gas sensor technology into new applications, offering less outgas and superior heat resistance in high-temperature environments. Application examples include air conditioners, air purifiers (with VOC sensors), gas alarms, and more.
CTE Closer to Silicon (Si)
Due to differences in their coefficients of thermal expansion (CTE), sensor chips made of Si, the most common material, face a higher risk of failure due to thermal stress when packaged in organic materials or metals. Ceramics, in contrast, have a CTE closer to Si, giving sensors packaged in ceramic higher reliability and lower risk of failure from thermal expansion mismatch.
Higher Reliability in High-Temperature Environments
The superior thermal resistance of ceramic materials makes them ideal for packaging devices used in high-temperature environments, including automotive gas sensors. For details, please check "Reliability in Harsh Environments."
Lids
Kyocera also provides ceramic lids to match the specific operating requirements of a gas sensor package. Ceramics can be designed with micro holes (less than 100µm in diameter), allowing dust- and water-resistance in gas sensors. Kyocera is now developing packages and lids with micro holes of less than 50µm in diameter. Please contact us for more information.
Features of Ceramic Packages for Metal Oxide Gas Sensors
