Manufacturing Processes for 3D Structures and 3D Electrical Interconnects
After firing, ceramics become extremely hard and difficult to process. Before this, however, a ceramic package's soft, pre-fired ceramic sheets allow us to create laminated, multilayer structures with conductor patterns in three dimensions.
Cavities (hollow spaces) and stacked vias are easily formed with these pre-fired sheets. Ceramic packages can be designed with a high degree of freedom, allowing us to design ceramic packages for diverse customer requirements.
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Click here for details of design and structures.
Other Key Technologies Supporting Innovation
Thin-Film Technology
Ceramic Package Features and Basic Structure
Wiring Technology: (Thick / Thin Film)
Integrated Simulation Capabilities
Material Options
Bonding Dissimilar Materials
Offering a Wide Variety of Package Designs and Structures
Co-Firing Technology
Plating Technologies for Multilayer Ceramic Packages
Customized Optical Window Lid Design
Product Categories