Improving Heat Dissipation by Heat Spreader

Challenge: Dissipating Heat from Microelectronic Devices

Because excess heat impairs performance and can cause device failure, thermal management is a top priority in microelectronic packaging. Kyocera offers a broad line of packaging materials that feature high thermal conductivity, enabling us to match the optimal package material with a customer's performance requirements. Additionally, Kyocera's advanced metallization technology allows us to braze thermally conductive metals, including copper, directly onto a ceramic package. This brazed metal serves as a heat spreader to enhance thermal performance even further.

Heat Spreader Design Examples

The illustration below shows examples of ceramic IC packages equipped with heat spreaders. Various other structures are also available; please contact us for details.

Material Properties: Heat-Spreader Metals Commonly Brazed to Ceramics

Kyocera can offer a wide variety of metal heat spreaders, as outlined below. ※O.F.H.C.：Oxygen Free High Conductivity

HEAT SPREADER MATERIAL OPTIONS		CTE ( /K ) ( RT~400℃ )	Thermal Conductivity ( W/(m・K) )	Thermal Resistance** ( K/W )	Bulk Density ( g/cm3 )	Vickers Hardness ( Hv )	Tensile Strength ( MPa )	Young's Modulus of Elasticity ( GPa )	Minimum Thickness (mm)
OFHC Copper		19.0 x 10-6	391	0.85	8.9	80	206	117	0.2
CuW	10/90 (%)	7.0 x 10-6	175	1.91	16.8	300	882	313	0.2
	15/85 (%)	7.8 x 10-6	185	1.80	16.3	280	843	294	0.2
	20/80 (%)	8.8 x 10-6	200	1.67	15.6	260	784	265	0.2
	25/75 (%)	9.5 x 10-6	230	1.45	14.8	240	686	225	0.2
CuMo	35/65 (%)	* 8.1 x 10-6	210	1.59	9.7	162	560	208	0.15
	40/60 (%)	* 8.5 x 10-6	220	1.52	9.5	180	608	206	0.15
	50/50 (%)	* 10.4 x 10-6	260	1.28	9.5	150	539	186	0.15
	60/40 (%)	* 10.8 x 10-6	275	1.21	9.4	130	461	157	0.15
CPC®141		* 7.8 x 10-6	200	1.67	9.5	N/A	380	160	0.5
CPC®232		* 8.8 x 10-6	235	1.42	9.3	N/A	350	130	0.7
KYCM®	Cu/Mo/Cu	7.3 ~10.5 x 10-6	260～310 (Vertical Direction)	1.08～1.75	8.9～9.2	N/A	Approx.324	N/A	1
CM360		15.5 x 10-6	360	0.93	N/A	N/A	N/A	130	1

（*）CTE of CuMo, CPC141, and CPC232 may vary depending on the rolling direction.
（**）Thermal resistance is calculated on the following conditions. Material size: 1.0 x 1.0 mm; material thickness: 1.0 mm. Excludes loss factor due to bonding material.
Click here for the simplified thermal resistance formula.

• Values above may vary with material changes or process improvement.
• "CPC" is a registered trademark of A.L.M.T. Corp., identifying a laminated heat dissipation substrate with Cu layers on top and bottom of CuMo compounds.
• "KYCM" and "CM360" are Kyocera’s original material codes.
• "KYCM" is a registered trademark of Kyocera Corporation in Japan and China.

Heat Spreader Characteristics

The chart below shows the relationship between thermal conductivity and CTE for each heat spreader material outlined above.