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Ceramic Packages, Submounts, and Lids for Optical Communications

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for Long-Haul Communications

for Mid-Haul Communications (Metro/DCI)

TO-Can Packages

LTCC Substrates

Thin-Film Submounts

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Kyocera provides a wide range of components for optoelectronics and optical communications modules, including packages, submounts, and lids.

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Box Packages (Long-Haul Communications)

Box Packages for Mid-Haul Communications (Metro / DCI)

TO-Can / Laser Diode (LD) Packages

LTCC Substrates for Superior High-Frequency Applications

Thin-Film Submounts for Laser Diodes

Products for Optical Communications Infrastructure

Optoelectronic device packages from Kyocera meet the high-speed, low-latency, high-reliability requirements of today’s advanced optical communications networks.

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Soution Examples

Kyocera's ceramic packages are widely utilized across various industries. This page highlights their key features along with practical applications

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Applications

This page allows you to explore products based on their applications.

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Key Technologies Supporting Innovation

We introduce Kyocera's core technologies. By combining multiple technologies, we offer solutions tailored to meet our customers' needs.

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