Ceramic Packages

TO-Can / Laser Diode (LD) Packages

TO-CAN

Kyocera offers TO-Can* packages with glass-to-metal bonding and high-frequency RF designs for high-speed fiber-optic communications. Our TO-Can packages are also available with a thin-film submount for laser device mounting.

*TO-Can refers to a "can"-style transistor-outline package

Features

High Frequency(Entire submount)
High Frequency
(Entire submount)
Hermetic Sealing
Hermetic Sealing

TO-Can Packages for EML/DML* Transmission

Cooled TO56 Header (for Single-Ended Transmission)

Cooled TO56 Header (for Single-Ended Transmission)

Kyocera’s TO56 packages can be mounted with a thermoelectric cooler (TEC). Input/output terminals can be designed for 50 GHz single-ended transmission lines.
*EML: Electro-absorption Modulated Laser; DML: Directly Modulated Laser.

Cooled TO60 Header (for Differential Transmission)

Cooled TO60 Header (for Differential Transmission)

Kyocera’s TO60 packages can also be TEC-equipped with input/output terminals optimized for 50 GHz differential transmission lines.

Uncooled TO56 & TO38 Header (for Differential Transmission)

Uncooled TO56 & TO38 Header (for Differential Transmission)

Available in TO56 and TO38 sizes, these laser diode packages feature input/output terminals designed for 50 GHz differential transmission lines.

AuSn TO-Can Packages
AuSn TO-Can Packages
Kyocera can also provide a pre-deposited AuSn option to improve the mounting yield and shorten processing time.

FAQ

Others

  1. Home
  2. Products
  3. Ceramic Packages
  4. Product Categories
  5. Ceramic Packages, Submounts, and Lids for Optical Communications
  6. TO-Can / Laser Diode (LD) Packages