Ceramic Packages / Ceramic Substrates

TO-Can / Laser Diode (LD) Packages

TO-CAN

Kyocera offers TO-Can* packages with glass-to-metal bonding and high-frequency RF designs for high-speed fiber-optic communications. Our TO-Can packages are also available with a thin-film submount for laser device mounting.

*TO-Can refers to a "can"-style transistor-outline package

Features

High Frequency(Entire submount)
High Frequency
(Entire submount)
Hermetic Sealing
Hermetic Sealing

TO-Can Packages for EML/DML* Transmission

Cooled TO56 Header (for Single-Ended Transmission)

Cooled TO56 Header (for Single-Ended Transmission)

Kyocera’s TO56 packages can be mounted with a thermoelectric cooler (TEC). Input/output terminals can be designed for 50 GHz single-ended transmission lines.
*EML: Electro-absorption Modulated Laser; DML: Directly Modulated Laser.

Cooled TO60 Header (for Differential Transmission)

Cooled TO60 Header (for Differential Transmission)

Kyocera’s TO60 packages can also be TEC-equipped with input/output terminals optimized for 50 GHz differential transmission lines.

Uncooled TO56 & TO38 Header (for Differential Transmission)

Uncooled TO56 & TO38 Header (for Differential Transmission)

Available in TO56 and TO38 sizes, these laser diode packages feature input/output terminals designed for 50 GHz differential transmission lines.

AuSn TO-Can Packages
AuSn TO-Can Packages
Kyocera can also provide a pre-deposited AuSn option to improve the mounting yield and shorten processing time.

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