Box Packages (Long-Haul Communications)
Fiber-optic networks keep pushing new limits for data speed and bandwidth. As a result, they require optical transceiver packages that support higher frequencies with high reliability.
Kyocera has supported high-speed design technologies since the early years of fiber-optic infrastructure, enabling new advances in optical communications.
Features
(200Gbps packages in development)
Kyocera’s design technology offers outstanding high-frequency performance customized to your requirements.
Our process for brazing metals to ceramics creates optoelectronic packages with high thermal conductivity and hermetic sealing, enhancing device and module reliability.
For Transmitters
CDM* Packages
Kyocera now mass-produces packages for 128G Baud transmission applications, with packages for 200G Baud in development. High-frequency input/output terminals can be designed for 100 GHz signals.
Kyocera can also recommend FPC* designs that connect directly to the package’s high-frequency terminals.
*CDM : Coherent Driver Modulator
*FPC: Flexible Printed Circuit
Tunable Laser Packages
High thermal conductivity heat spreaders made of CuW and CuMo are brazed to ceramics to dissipate heat from laser diodes efficiently.
For Receivers
ICR* Packages
Packages for 128G Baud reception applications are available now, with 200G Baud in development. High-frequency input/output terminals can be designed for 100 GHz signals.
Kyocera can also recommend FPC* designs that connect directly to the package’s high-frequency terminals.
*ICR: Integrated Coherent Receiver
*FPC: Flexible Printed Circuit
For Transceivers
TROSA* Packages
Packages are available now for 128G Baud transmission/reception applications. High-frequency input/output terminals can be designed for 100 GHz signals.
Kyocera can also recommend an FPC* design that connects directly to the package’s high-frequency terminals.
*TROSA: Transmitter & Receiver Optical Sub Assembly
*FPC: Flexible Printed Circuit
For Amplifier (Pump Laser Source)
Packages for Pump Lasers
To dissipate heat from laser diodes efficiently, these packages incorporate thermally conductive heat spreaders (such as CuW or CuMo), and terminals with ceramic feedthrough structure.
