LTCC Substrates for Superior High-Frequency Applications
LTCC Substrates for Superior High-Frequency Applications
Kyocera develops LTCC substrates for optical communication devices utilizing Si photonics technology.
*LTCC: Low Temperature Co-Fired Ceramics
Features
Superior High-Frequency Characteristics
Less Thermal Deformation
Design Flexibility;
Multilayer 3D Structure
Multilayer 3D Structure
Superior High-Frequency Characteristics
Lower Thermal Deformation
Design Flexibility; Multilayer 3D Structure
*Kyocera supports solder-on-pad (SOP) for flip chip substrates only
Example: Integrated Transceiver Substrates
Substrate for COSA Application
Kyocera offers ceramic substrates for high-speed data applications (128G Baud), creating notches and cavity shapes to match your specifications.
※COSA: Coherent Optical Sub Assembly
FAQ
Solutions
Applications
Materials
