Ceramic Packages

Box Packages for Mid-Haul Communications (Metro / DCI)

Box Packages for Mid-Haul Communications (Metro / DCI)

Fiber-optic networks keep pushing new limits for data speed and bandwidth. As a result, they require optical transceiver packages that support higher frequencies with high reliability.
Kyocera has supported high-frequency design technologies since the early years of fiber-optic infrastructure, enabling new advances in optical communications.

Features

High Frequency High Speed (200G Baud packages in development)
High Frequency High Speed
(200G Baud packages in development)
Hermetic Sealing
Hermetic Sealing
High Thermal Dissipation
High Thermal Dissipation

Kyocera’s design technology offers outstanding high-frequency performance customized to your requirements.
Technology for brazing metals to ceramics creates optoelectronic packages with high thermal conductivity and hermetic sealing, enhancing device and module reliability.

For Transmitters

CDM* Packages

CDM Packages

Kyocera currently mass-produces packages for 128G Baud transmission applications and is also developing packages for 200G Baud. High-frequency input/output terminals can be designed for 100 GHz signals. Kyocera can also recommend FPC* designs that connect directly to the package’s high-frequency terminals.

*CDM: Coherent Driver Modulator
*FPC: Flexible Printed Circuit

Tunable Laser Packages

Tunable Laser Packages

Thermally conductive heat spreaders such as CuW or CuMo are brazed to ceramics to dissipate heat from laser diodes efficiently.

QSFP* TOSA* Packages

QSFP TOSA Packages

TOSA packages are available in QSFP28 and QSFP56 form factors. High-frequency input/output terminals can be designed for 80 GHz signals.

*QSFP: Quad Small Form-factor Pluggable
*TOSA: Transmitter Optical Sub Assembly

EML* Packages

EML Packages

EML packages are available in QSFP28 and QSFP56 form factors. High-frequency input/output terminals can be designed for 80 GHz signals.

*EML: Electro-absorption Modulator Laser

For Receivers

Ceramic ICR* Packages

Ceramic ICR Packages

Packages are available now for 128G Baud reception applications, with 200G Baud in development. High-frequency input/output terminals can be designed for 100 GHz signals. Kyocera can also recommend FPC* designs that connect directly to the package’s high-frequency terminals.

*ICR : Integrated Coherent Receiver
*FPC: Flexible Printed Circuit

QSFP ROSA* Packages

QSFP ROSA Packages

TOSA packages for QSFP28 and QSFP56 form factors are available now. High-frequency input/output terminals can be designed for 80 GHz signals.

*ROSA: Receiver Optical Sub Assembly

For Transceivers

TROSA* Packages

TROSA Packages

Packages are available for 128G Baud transmission applications now. High-frequency input/output terminals can be designed for 100 GHz signals. Kyocera can also recommend FPC2 designs that connect directly to the package’s high-frequency terminals.

*TROSA: Transmitter & Receiver Optical Sub Assembly

LTCC Packages and Substrates for COSA*

LTCC Packages and Substrates for COSA

Packages are available for 128G Baud applications now. Cutouts and cavity shapes can be easily formed.

*COSA: Coherent Optical Sub Assembly

FAQ

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