Ceramic Packages and Lids for Optical Sensors
Optical sensors have become indispensable for detecting light across a wide range of wavelengths. Kyocera supplies ceramic packages for various optical sensor applications, ranging from line sensors to high-density 8K devices and high-end space LiDAR sensors offering excellent thermal management solutions.
Kyocera also offers a selection of window lid options for optical sensor packages, including window lids for IR sensors.
Features
Application Examples
Surface-Mount IR Sensor Package Concept
3-pin TO-CAN packages for IR sensors can now be replaced by reflowable surface-mount ceramic packages with 3D integrated internal routing for miniaturization. Kyocera can design custom packages for your specific chip sizes and thermal management requirements.
Surface-Mount IR Sensor Package Structure
Dual-Cavity Miniaturization Option
High-End IR Sensor Concept
- Alumina and AlN (Aluminum Nitride) materials offer high thermal dissipation
- For optimum reliability, device is mounted to PCB through pin insertion
- Available with hermetic sealing
- Metal-on-ceramic enhances thermal dissipation further
- Metal Wall Packages offer reliable hermetic packaging solutions. Pinch-off tubes enable vacuum sealing
Window Lids for Infrared Applications
Kyocera also offers window lids for infrared applications with windows of silicon, sapphire, or germanium.
Silicon windows for AuSn hermetic sealing.
Germanium windows bonded with Fe-Ni-Co alloy for hermetic sealing.
Sapphire window is bonded with Fe-Ni-Co alloy lid for resistance welding.
