Ceramic Substrates and Packages for Indoor / Outdoor Lighting
Light Emitting Diodes (LEDs) have a shorter lifespan when exposed to high temperatures, so managing the heat they generate is crucial. Kyocera provides ceramic packages and substrates with higher thermal conductivity that can dissipate heat from LEDs efficiently.
Features
Higher Thermal Dissipation
High Thermal Conductivity
High Thermal Conductivity
Cavity Structure / Design Flexibility
Simplifies Resin Potting
Simplifies Resin Potting
Hermetic Sealing
Protects from Outside Influence
Protects from Outside Influence
Various Plating Layer Options
Concept
Surface-Mount Multilayer Packages (Alumina / Aluminum Nitride)
Round Cavity
Square Cavity
Hermetic Sealing
Stepped Structure for Lid Placement
(Cross-section)
Easy lid placement for sealing
Easy lid placement for sealing
Angled Cavity
(Cross-section)
Cavity walls serve as reflectors
Cavity walls serve as reflectors
With Heat Spreader
(Cross-section)
Cu fittings optimize heat dissipation (Alumina only)
Cu fittings optimize heat dissipation (Alumina only)
Single-Layer Thin-Film Substrates
- Available in higher heat-dissipating aluminum nitride (thermal conductivity: 170–230W/m・K).
- Plating layer configurations can be customized per different requirements.
Example: Ti-Au-Sn simplifies device mounting.
Other layer-configuration options are available here.
Multilayer Ceramic Substrates + Thin-Film Integration
*An example of Multilayer + Thin-Film
Thin-films can also be applied to multilayer ceramic packages and substrates, including circuit designs with 3-D routing between layers, for multi-chip or multi-element mounting.
FAQ
Materials
