Ceramic Packages

Ceramic Substrates and Packages for Vertical-Cavity Surface-Emitting Lasers (VCSELs)

Ceramic Substrates/Packages for Vertical-Cavity Surface-Emitting Lasers (VCSELs)

Laser diodes (LDs) experience shorter lifespans when exposed to high temperatures, making thermal management essential.
Kyocera's ceramic packages and substrates offer superior thermal conductivity to dissipate heat efficiently from LDs and ICs. We can provide ceramic packages and submounts tailored to a wide range of customer requirements.

Features

Superior Thermal Dissipation
Superior Thermal Dissipation
Surface Mounting
Surface Mounting
Miniaturization
Miniaturization
Design Flexibility
Design Flexibility
Hermetic Sealing
Hermetic Sealing
Various Thin-Film Options
Various Thin-Film
Options

Surface Mount Ceramic Multilayer Package

Examples

Surface Mount Ceramic Multilayer Package

Features

  • Multilayer ceramic packages enable cavity structures.
  • Hermetic sealing options are available.
  • Inductance/resistance can be improved by increasing the number of vias.

Low Inductance/Resistance Design

Low Inductance/Resistance Design
  • Shelf structure minimizes bonding wire length.
  • Multilayer ceramic package design allows a multitude of vias.
    →Decreases package inductance.
    →Reduces device pulse width.
    →Increases laser output strength/pulse frequency
    ⇒Contributes to long-distance/high-resolution pulse lasers.

Additional Function

Vents
Vents
  • The customized cavity shape allows the formation of vents.

(Vent: A hole to release gases from adhesives and other materials during diffuser installation.)

Eye Safety
eye_safety_img

By utilizing 3D routing, a single safety circuit can be formed through the diffuser, package, and VCSEL. In the case of diffuser detachment, the VCSEL loses power, preventing harmful irradiation.

Laser Submounts

Laser Submounts

Features

  • Coatings are applied to the polished flat surface, minimizing optical axis deviation.
  • Optional AuSn deposition is available, which eliminates AuSn preforms for assembly.
With AuSn deposition
Without AuSn deposition
Without AuSn deposition
With AuSn deposition

FAQ

Others

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