Heat Spreader Metal Options for Ceramic Packages

One of the key functions of a package is to dissipate heat generated by the device efficiently. Devices with high power output may require a heat spreader. Kyocera has developed advanced technologies to bond highly thermally conductive metals, such as copper, onto ceramics, creating IC packages that offer superior thermal performance.

Material Properties: Heat Spreader

※O.F.H.C.：Oxygen Free High Conductivity

HEAT SPREADER MATERIAL OPTIONS		CTE ( /K ) ( RT~400℃ )	Thermal Conductivity ( W/(m・K) )	Thermal Resistance** ( K/W )	Bulk Density ( g/cm3 )	Vickers Hardness ( HV )	Tensile Strength ( MPa )	Young's Modulus of Elasticity ( GPa )	Minimum Thickness (mm)
OFHC Copper		19.0 x 10-6	391	0.85	8.9	80	206	117	0.2
CuW	10/90 (%)	7.0 x 10-6	175	1.91	16.8	300	882	313	0.2
	15/85 (%)	7.8 x 10-6	185	1.80	16.3	280	843	294	0.2
	20/80 (%)	8.8 x 10-6	200	1.67	15.6	260	784	265	0.2
	25/75 (%)	9.5 x 10-6	230	1.45	14.8	240	686	225	0.2
CuMo	35/65 (%)	* 8.1 x 10-6	210	1.59	9.7	162	560	208	0.15
	40/60 (%)	* 8.5 x 10-6	220	1.52	9.5	180	608	206	0.15
	50/50 (%)	* 10.4 x 10-6	260	1.28	9.5	150	539	186	0.15
	60/40 (%)	* 10.8 x 10-6	275	1.21	9.4	130	461	157	0.15
CPC®141		* 7.8 x 10-6	200	1.67	9.5	N/A	380	160	0.5
CPC®232		* 8.8 x 10-6	235	1.42	9.3	N/A	350	130	0.7
KBCM	Cu/Mo/Cu	7.3 ~10.5 x 10-6	260～310 (Vertical Direction)	1.08～1.75	8.9～9.2	N/A	Approx.324	N/A	1
CM360		15.5 x 10-6	360	0.93	N/A	N/A	N/A	130	1

（*）CTE of CuMo, CPC141, and CPC232 may vary depending on the material's rolled direction.
（**）Thermal resistance is calculated on the conditions below.
Heat source: 1.0 x 1.0 mm; heat spreader thickness: 1.0 mm; bonding material loss not included.
Click here for a simplified formula to calculate thermal resistance.

• Values above may vary with material changes or process improvement.
• "CPC" is a registered trademark of A.L.M.T. Corp., identifying a laminated heat dissipation substrate with Cu layers on top and bottom of CuMo compounds.
• "KBCM" is Kyocera's original material with high thermal conductivity. (Kyocera Brazed Copper - Molybdenum)
• "CM360" are Kyocera's original material codes.

Heat Spreader Characteristics

The chart below shows the relationship between thermal conductivity and CTE in various heat spreader materials.

Examples of IC Packages with Heat Spreaders

The illustration below shows examples of IC packages incorporating heat spreaders. Other structures can also be manufactured using various materials. Please contact us for details.