Solutions

Chip-Level Reliability

Multiple variables can jeopardize device reliability during chip assembly, where components are mounted onto packages. Solutions using Kyocera's ceramic packages are outlined on the following page.

Common Challenges

Matching Coefficients of Thermal Expansion

CTE matching between different materials improves reliability and reduces stress on the chip

Ni-Pd-Au Plating

Prevents chip-level packaging failure; improves board-level solder reliability.

Rigidity and Strength

Mechanical/thermal advantages enhance reliability, promote miniaturization, and improve sensing accuracy.

Solutions Top Page

Product Categories

Materials

Technologies

Others

Soution Examples

Kyocera's ceramic packages are widely utilized across various industries. This page highlights their key features along with practical applications

Details

Applications

This page allows you to explore products based on their applications.

Details

Key Technologies Supporting Innovation

We introduce Kyocera's core technologies. By combining multiple technologies, we offer solutions tailored to meet our customers' needs.

Details