Ceramic Packages

Ceramic Packages for Automotive Inertial Sensors

Ceramic Packages for Automotive Inertial Sensors

Widespread adoption of ADAS* is creating demand for extremely accurate automotive inertial sensors.
High rigidity and reduced deformation at higher temperatures help ceramic packages improve sensor performance by optimizing MEMS device functionality.
*ADAS: Advanced Driver-Assistance Systems

Features

High Rigidity
High Rigidity
Minimal Heat Deformation
Minimal Heat
Deformation
CTE Close to Si
CTE Close to Si
Structural Options
Structural Options
Hermetic Sealing
Hermetic Sealing

High Rigidity

A substrate rigidity comparison of organic vs. ceramic is shown below.

Simulation: ASIC Deformation with Force Applied to the Substrate Edge

simulation_img01

A substrate rigidity comparison of organic vs. ceramic is shown below.

When equal force is applied to organic and ceramic substrates, ceramic substrates show significantly reduced ASIC deformation.

Reduced Thermal Deformation

A simulation comparing deformation at the IC chip edge when heat is applied to organic and ceramic substrates is shown below.

Deformation%20at%20IC%20Chip%20Edge

IC chips mounted on a ceramic substrate exhibit reduced deformation at higher temperatures, improving sensing functionality.

Proposal: Integrated Sensor with Combined Functions

Proposal: Integrated Sensor with Combined Functions

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