Ceramic Packages

Ceramic Packages for SAW Devices

Ceramic Packages for SAW Devices

Surface Acoustic Wave (SAW) devices are primarily integrated into smartphones. As smartphones continue to advance in functionality, the number of electronic components they incorporate increases, leading to demands for miniaturization and low-profile designs. Kyocera's ceramic packages, with their exceptional material properties, have been consistently adopted for SAW devices by keeping pace with these size trends.

Features

Low CTE Close to Si
Low CTE
Close to Si
Low-Profile Structure
Low-Profile Structure
Higher Thermal Dissipation & Higher Thermal Conductivity
Higher Thermal Dissipation &
Higher Thermal Conductivity
Hermetic Sealing
Hermetic Sealing
Higher Rigidity
Higher Rigidity

Low Coefficient of Thermal Expansion (CTE)

SAW devices are susceptible to deformation at high temperatures, which can impair their performance. Since ceramics have low CTE, they prevent deformation, which helps SAW devices maintain their operating characteristics amid the heat produced by surrounding components.

Low-Profile Structure

Kyocera’s ceramic packages can be mass-produced from ultra-thin (0.1mm) substrates, enabling lower-profile SAW devices.

Higher Thermal Conductivity

Ceramic packages offer higher thermal conductivity to efficiently dissipate heat from the devices.

Hermetic Sealing

Ceramic packages can be sealed hermetically to extend the life of the device.

Higher Rigidity

Ceramic packages resist deformation under pressure, further protecting SAW devices from the surrounding environment.

Size Trends: Packages for SAW filters

As demanding functionality adds more SAW devices and other components to densely populated circuit boards, demand for smaller, lower-profile components continues to grow. Kyocera’s ceramic packages are key to meeting these challenging requirements.

SAW_trend

Other Application Examples

Concept of Ceramic Packages for BAW Devices (Cross-Sectional View)

Cavity Type

Concept of Ceramic Packages for BAW Devices (Cross-Sectional View)
Features
  • Cavity structure enables hermetic sealing
  • Supports both wire bonding and flip-chip bonding

Substrate Type

BAWCSP
Features
  • Miniaturized/low profile
  • Can be sealed hermetically with a cup-shaped lid

What Are SAW Devices?

SAW devices operate by the principle of wave propagation along the surface of a solid elastic material, a phenomenon known as a “Surface Acoustic Wave.” Examples of electronic components utilizing this phenomenon include SAW filters and SAW duplexers.

What Are SAW Filters?

SAW filters are components that use surface acoustic waves to selectively pass or block specific frequencies in electronic circuits. Examples include band-pass filters, high-pass filters, low-pass filters, and band-elimination filters.

What Are SAW Duplexers?

SAW duplexers, which are composed of two band-pass filters, apply surface acoustic waves to electrically separate the transmit (Tx) and receive (Rx) signals.

What Are BAW Devices?

BAW devices use the principle of wave propagation through a medium with three-dimensional expansion, known as a “Bulk Acoustic Wave.” Examples include BAW filters and BAW duplexers.

What Are BAW Filters?

Like SAW filters, BAW filters are components that selectively pass or block specific frequencies. While SAW filters utilize surface acoustic waves, BAW filters use bulk acoustic waves.

What Are BAW Duplexers?

Like SAW duplexers, BAW duplexers are components that electrically separate transmit (Tx) and receive (Rx) signals, but they use bulk acoustic waves rather than surface acoustic waves.

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