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Ceramic Packages for Logic ICs

Kyocera provides LTCC (Low-Temperature Co-Fired Ceramic) packages for LSI (Large Scale Integration) chips and other advanced semiconductors. Our LTCC materials offer the following features:

Lower-loss at higher frequencies, compared to organic build-up substrates.
- Low dielectric constant
- Low dielectric loss tangent
- Low frequency dependence
Kyocera offers low-CTE materials with a coefficient of thermal expansion close to Si; and high-CTE materials with a CTE closely approximately that of the PCB (Printed Circuit Board).
Low thermal deformation
High mechanical strength

Features

Lower Thermal Deformation

CTE Matching

High-Frequency Characteristics

Material		Characteristics
LTCC	GL773	With its higher CTE value, this LTCC material ensures board-level assembly reliability and is suitable for larger-footprint package designs. It also exhibits a lower dielectric loss tangent.
LTCC	GL570	With a lower CTE value closer to silicon, this material ensures chip-level reliability and is suitable for attaching larger Si chips. It also exhibits a lower dielectric loss tangent.