Features: GL570 / GL773
- Lower loss (compared to organic built-up substrates) at higher frequencies
- Lower dielectric constant
- Lower dielectric loss tangent
- Lower dependency on frequency
- With GL570 and GL773, Kyocera offers materials that closely match the CTE of Si or PCB
- Less deformation with temperature change
- Higher flexural strength
*Material properties are representative values and subject to change.
Transmission at High Frequency
Lower Transmission Loss
Low Impedance Variation
Design Flexibility
Mechanical Characteristics
Coefficient of Thermal Expansion (CTE)
To enhance assembly reliability, Kyocera can provide package materials with a CTE closer to either the IC chip or board.
Kyocera offers multiple LTCC material options and package designs to meet both high-frequency and high CTE requirements.
Design Options
Allows shorter bonding wires, improving inductance losses
Less Thermal Deformation
Applications
- Cutting-edge semiconductor devices
