Ceramic Packages

Product Preparation for Shipping

Challenge: Reducing CapEx When Changing Microelectronic Package Materials

Adopting a new microelectronic package material usually requires process changes and capital expenditure (CapEx).
Kyocera enables you to maintain existing equipment and reduce CapEx by offering various shipping solutions for fully singulated parts, partially singulated parts, and parts to be singulated by the customer.

Customized Singulation Solutions

Kyocera offers shipping solutions designed for compatibility with your existing production line, as shown below.
Some options may be limited to specific package configurations.

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MAT Shipping🄬 Solution

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"MAT Shipping" is a registered trademark of Kyocera Corporation in Japan.

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