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Ceramic Packages
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Options for Chip-Level and Board-Level Assembly

Ceramic packaging allows various assembly options to support device specifications. This section outlines options for chip-level assembly, in which the chip is mounted on the package, and board-level assembly, in which the packaged device is mounted on the PCB.

Common Challenges
Board-Level Mounting Options
Packages can be designed for specific mounting requirements, including leads for high-strength attachment or pads for surface mounting.
Package Structure for Chip-Level Assembly
Package structure can be designed to optimize chip-level assembly.
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Kyocera's ceramic packages are widely utilized across various industries. This page highlights their key features along with practical applications
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