Fine Ceramics(Advanced Ceramics)
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Electrostatic Chucks (ESCs)

Highly plasma-resistant chucks perform well in a wide range of operating temperatures.
静電チャック

An internal electrode is embedded to utilize the electrostatic force generated between this structure and the Si wafer placed on the ESC surface. This product is used for silicon wafer mounting, flatness correction and cooling the silicon wafer during the semiconductor manufacturing process.

Property :
Plasma Resistance

Product Data

Material AluminaAluminum Nitride
Size For φ200/300mm equipment

Applications

  • Wafer Holding / Flatness Correction / Cooling

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