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SiC (Silicon Carbide) Polishing Plates
Less deformation through lower thermal distribution. Stronger chemical resistance.
A range of surface profiles are available.
A range of surface profiles are available.
Polishing plate features minimal deformation due to high thermal conductivity, low thermal expansion coefficient, high stiffness and excellent thermal uniformity. It also features excellent chemical resistance and various surface profile options including concave, flat or convex.
- Property :
- High Young's Modulus
- Low Thermal Expansion
- High Thermal Conductivity
- Chemical Resistance
- Thermal Uniformity
Product Data
| Material | Silicon Carbide |
|---|---|
| Shape | Convex, flat and concave available. |
| Size | MAXφ30" |
| Precision | Flatness: 1μm or less |
Applications
- Wafer Polishing
