Kyocera's extensive know-how has made it possible to perform micro machining and finish complex shapes on single-crystal sapphire, a highly stiff and transparent material that was previously difficult to machine using lasers.
φ30mm × 0.1mm
Hole Diameter (D): from φ0.03 mm (for φ0.03 mm, maximum thickness is 0.1 mm)
Thickness (T): up to 1 mm thick (for 1 mm thickness, minimum hole diameter is φ0.1 mm))
*Available hole diameter (D) varies depending on the substrate thickness (T). Please contact us for details.
Outer Shape: up to 230 mm square shape
Thickness: up to 1 mm
Width: up to 100 μm
Depth: from 100 μm
Cross-Section Image (A-A')
Hole Diameter: 75 μm
Tolerance: ± 1.5 μm TYP
Roundness: 3 μm TYP
Surface Roughness: 0.6 μm TYPMinimizes alteration of material caused by the effect of heat and achieves a finish equivalent to machined surfaces.
* Values listed above are intended for reference and may vary depending on the specifications/conditions.
Values are based on typical material properties and
may vary according to product configuration and manufacturing process.