Ceramic Packages

Glossary

G-H-I

GND Shield

Solid patterns and vias connected to a ground (GND) shield and protect transmission lines to prevent transmission losses, crosstalk, and noise from other components or patterns.

Glass Epoxy Substrate

A type of printed circuit board made by impregnating epoxy resin into a laminate of woven glass fiber (glass cloth).

Heat Resistance

The ability of a material or substance to withstand high temperatures without being damaged or losing its properties.

Heat Spreader

A metal component for semiconductor packages with higher thermal conductivity that is used to dissipate heat generated by the devices. Also called a heat sink.

Hermetic Seal

For high-reliability applications, hermetic seals, such as those created by seam welding, protect components from the external environment, including moisture and contaminants. Seals with lower airtightness are referred to as non-hermetic seals.

High Resolution

The ability to detect, measure, distinguish, or replicate details in images, patterns, or objects with exceptional clarity and precision.

IATF 16949 (International Automotive Task Force 16949)

A global quality management system standard specific to the automotive industry.

Impedance

The electrical resistance in an AC (alternating-current) circuit. It is calculated by resistance (R), which is constant regardless of frequency, inductance (L), and capacitance (C), which vary depending on the frequency. Unit: Ω (Ohm)

Inductance

The property that generates an induced electromotive force in response to changes in current, which occurs in an electronic component such as a coil. Inductance is generally a source of noise in a microelectronic package. Unit: H (Henry)

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