G-H-I
GND Shield
Solid patterns and vias connected to a ground (GND) shield and protect transmission lines to prevent transmission losses, crosstalk, and noise from other components or patterns.
Glass Epoxy Substrate
A type of printed circuit board made by impregnating epoxy resin into a laminate of woven glass fiber (glass cloth).
Heat Resistance
The ability of a material or substance to withstand high temperatures without being damaged or losing its properties.
Heat Spreader
A metal component for semiconductor packages with higher thermal conductivity that is used to dissipate heat generated by the devices. Also called a heat sink.
Hermetic Seal
For high-reliability applications, hermetic seals, such as those created by seam welding, protect components from the external environment, including moisture and contaminants. Seals with lower airtightness are referred to as non-hermetic seals.
High Resolution
The ability to detect, measure, distinguish, or replicate details in images, patterns, or objects with exceptional clarity and precision.
IATF 16949 (International Automotive Task Force 16949)
A global quality management system standard specific to the automotive industry.
Impedance
The electrical resistance in an AC (alternating-current) circuit. It is calculated by resistance (R), which is constant regardless of frequency, inductance (L), and capacitance (C), which vary depending on the frequency. Unit: Ω (Ohm)
Inductance
The property that generates an induced electromotive force in response to changes in current, which occurs in an electronic component such as a coil. Inductance is generally a source of noise in a microelectronic package. Unit: H (Henry)