Sealing Options

Methods to seal microelectronic packages vary depending on the device's application and requirements. Kyocera offers ceramic packages and lids and can propose the most suitable sealing method to meet your needs.

Typical Sealing Methods for Ceramic Packages

Sealing Method	Glass Frit Sealing	Epoxy Resin Sealing	Solder Sealing	Seam Welding
Lid Material	Ceramic			ー
	ー	Metal
Sealing Temperature	320℃～	120℃-150℃	320℃	Device temperature below 200℃
Advantages	Hermetic seal Good for productivity (when using a belt furnace)	Seals at low temperature (<150℃) for less thermal stress on IC)	Hermetic seal Less thermal stress GND/shielding effect when using metal lid	Hermetic seal Heat applied in limited welded area GND shielding effect
Disadvantages	Comparatively high sealing temperature Glass frit material contains lead	Not hermetic seal (moisture permeable)	Comparatively high sealing temperature	Requires a metal seal ring on the package
Remarks	Lead-free glass frit is available (sealing temperature: 460℃)	Kyocera can provide glass lid, silicon lid, or lid with B-stage epoxy	Kyocera can provide vacuum sealing with gold-tin (AuSn) material	Kyocera can provide vacuum sealing
Structure image

*GND: ground

For details on hermetic sealing, click here.

Lid Examples

Kyocera offers various types of lids for different sealing methods.

Glass Frit Sealing (lid material: ceramic, glass)

Epoxy Resin Sealing (materials: ceramic, glass, metal)

Gold-tin (AuSn) Solder Sealing

Seam Welding (optical window bonded metal lids)

For more information on lids, click here.

Kyocera offers a wide range of standard and custom-made lid products to meet unique needs, with or without sealing material.

Sealing Area of Packages

The sealing area of a microelectronic package can be designed to meet specific requirements
(examples: with or without metallization; with or without a seal ring).