Ceramic Packages

Glossary

M-N-O

MEMS (Micro-Electro-Mechanical Systems)

A technology that integrates tiny mechanical and electrical components, often on a microscopic scale, using microfabrication techniques similar to those used for integrated circuits.

Motherboard

The main printed circuit board (PCB) on which electronic components are mounted.

NDIR (Non-Dispersive Infrared)

A method for measuring gas concentrations by using infrared light absorption without dispersion.

O.F.H.C. Copper (Oxygen-Free High Conductivity Copper)

A highly pure copper with very low oxygen content, used for applications requiring high electrical conductivity and reliability.

Optical Properties

The transmission and reflection characteristics of light over a range of wavelengths, often used as a performance indicator of coatings and filters designed to transmit or shield specific wavelength ranges, such as ultraviolet, visible, and infrared.

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