Ceramic Packages

Glossary

A-B-C

ADAS (Advanced Driver Assistance System)

A general term for functions that assist drivers with various driving tasks.

AR Coating (Anti-Reflection Coating)

A coating applied to surfaces like glass window lids to minimize the reflection of a specific wavelength range of light.

ASIC (Application Specific Integrated Circuit)

An integrated circuit designed and manufactured for a specific application or device.

Anode

The electrode or terminal (for example, in a diode or LED) into which current flows from an external circuit. It is also known as the "positive" terminal.

B-stage (Semi-Cured) Epoxy

A partially cured epoxy system where the resin and curing agent have begun to react, but the cross-linking process is not yet complete, allowing for further curing under specific conditions. It prevents dripping after application.

Baking

A process of heating unsealed packages just before sealing to remove moisture from components inside the package.

Castellation

Notches cut into the sides of a surface-mount ceramic package and metallized to provide electrical connection. Castellations can improve board-level bonding strength through solder fillet formation.

Cathode

The electrode or terminal (for example, in a diode or LED) from which current flows out to the external circuit. It is also known as the "negative" terminal.

Cavity

A recessed area within a microelectronic package where semiconductor devices and components are attached.

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