Ceramic Packages for Microwave Power Transistors (up to 20GHz)

Overview

Details

Microwave Power Transistors

Millimeter-Wave

MIC Substrates

Ceramic Packages for Microwave Power Transistors (up to 20GHz)

Kyocera offers packages for compound semiconductors (including GaN/GaAs), which are used in FET and HEMT devices for microwave communication. High thermal-conductive heat spreaders support high-power and high-reliability applications.

*FET: Field Effect Transistor
*HEMT: High Electron Mobility Transistor

Features

High Thermal Conductivity

High Frequency Design

High Reliability

Heat-Spreader Material Characteristics

※O.F.H.C.：Oxygen Free High Conductivity

Available Heat-Spreader Materials		Coefficient of Linear Thermal Expansion (/K) (RT ~400℃)	Thermal Conductivity (W/m・K)	Thermal Resistance (K/W)	Bulk Density (g/cm³)	Hardness (Hv)	Tensile Strength (MPa)	Young’s Modulus of Elasticity (Gpa)	Heat-Spreader Min Thickness (mm)
O.F.H.C Copper		19.0 x 10^-6	391	0.85	8.9	80	206	117	0.2
Copper Tungsten (CuW)	10/90 (%)	7.0 x 10^-6	175	1.91	16.8	300	882	313	0.2
	15/85 (%)	7.8 x 10^-6	185	1.80	16.3	280	843	294	0.2
	20/80 (%)	8.8 x 10^-6	200	1.67	15.6	260	784	265	0.2
	25/75 (%)	9.5 x 10^-6	230	1.45	14.8	240	686	225	0.2
Copper Molybdenum	35/65 (%)	* 8.1x 10^-6	210	1.59	9.7	162	560	208	0.15
	40/60 (%)	* 8.5x 10^-6	220	1.52	9.5	180	608	206	0.15
	50/50 (%)	* 10.4x 10^-6	260	1.28	9.5	150	539	186	0.15
	60/40 (%)	* 10.8x 10^-6	275	1.21	9.4	130	461	157	0.15
CPC^®141		* 7.8 x 10^-6	200	1.67	9.5	N/A	380	160	0.5
CPC^®232		* 8.8x 10^-6	235	1.42	9.3	N/A	350	130	0.7
KYCM^®	Cu/Mo/Cu	7.3 ~10.5 x 10^-6	260 ~310 (Vertical Direction)	1.08~1.75	8.9 ~ 9.2	N/A	Approx.324	N/A	1
CM360		15.5 x 10^-6	360	0.93	N/A	N/A	N/A	130	1

(*)Coefficient of Linear Thermal Expansion (CLTE) value for CuMo, CPC141 and CPC232 changes depending on the the rolling direction.
(**)Thermal Resistance: The listed values are calculated values. Heating element size 1.0x1.0mm, Heat-spreader thickness 1.0mm, and loss due to the bonding material are not included.
Click here for additional information on the thermal resistance calculation.

Nominal value; values may change due to changes in materials or processes.
CPC (a registered trademark of A.L.M.T. Corp.) is a heat-spreader substrate with a CuMo layer laminated with Cu layers for the top and bottom surfaces.
“KYCM” and “CM360” are Kyocera’s original material codes.
“KYCM” is a registered trademark of Kyocera Corporation in Japan and China.