Ceramic Packages for Microwave Power Transistors (up to 20GHz)

Overview

Details

Microwave Power Transistors

Millimeter-Wave

MIC Substrates

Ceramic Packages for Microwave Power Transistors (up to 20GHz)

Kyocera offers packages for compound semiconductors (including GaN/GaAs), which are used in FET and HEMT devices for microwave communication. High thermal-conductive heat spreaders support high-power and high-reliability applications.

*FET: Field Effect Transistor
*HEMT: High Electron Mobility Transistor

Features

High Thermal Conductivity

High Frequency Design

High Reliability

Heat-Spreader Material Characteristics

※O.F.H.C.：Oxygen Free High Conductivity

Available Heat-Spreader Materials		Coefficient of Linear Thermal Expansion (/K) (RT ~400℃)	Thermal Conductivity (W/m・K)	Thermal Resistance (K/W)	Bulk Density (g/cm³)	Hardness (Hv)	Tensile Strength (MPa)	Young’s Modulus of Elasticity (Gpa)	Heat-Spreader Min Thickness (mm)
O.F.H.C Copper		19.0 x 10^-6	391	0.85	8.9	80	206	117	0.2
Copper Tungsten (CuW)	10/90 (%)	7.0 x 10^-6	175	1.91	16.8	300	882	313	0.2
	15/85 (%)	7.8 x 10^-6	185	1.80	16.3	280	843	294	0.2
	20/80 (%)	8.8 x 10^-6	200	1.67	15.6	260	784	265	0.2
	25/75 (%)	9.5 x 10^-6	230	1.45	14.8	240	686	225	0.2
Copper Molybdenum	35/65 (%)	* 8.1x 10^-6	210	1.59	9.7	162	560	208	0.15
	40/60 (%)	* 8.5x 10^-6	220	1.52	9.5	180	608	206	0.15
	50/50 (%)	* 10.4x 10^-6	260	1.28	9.5	150	539	186	0.15
	60/40 (%)	* 10.8x 10^-6	275	1.21	9.4	130	461	157	0.15
CPC^®141		* 7.8 x 10^-6	200	1.67	9.5	N/A	380	160	0.5
CPC^®232		* 8.8x 10^-6	235	1.42	9.3	N/A	350	130	0.7
KBCM	Cu/Mo/Cu	7.3 ~10.5 x 10^-6	260 ~310 (Vertical Direction)	1.08~1.75	8.9 ~ 9.2	N/A	Approx.324	N/A	1
CM360		15.5 x 10^-6	360	0.93	N/A	N/A	N/A	130	1

(*)Coefficient of Linear Thermal Expansion (CLTE) value for CuMo, CPC141 and CPC232 changes depending on the the rolling direction.
(**)Thermal Resistance: The listed values are calculated values. Heating element size 1.0x1.0mm, Heat-spreader thickness 1.0mm, and loss due to the bonding material are not included.
Click here for additional information on the thermal resistance calculation.

Values above may vary with material changes or process improvement.
"CPC" is a registered trademark of A.L.M.T. Corp., identifying a laminated heat dissipation substrate with Cu layers on top and bottom of CuMo compounds.
"KBCM" is Kyocera's original material with high thermal conductivity. (Kyocera Brazed Copper – Molybdenum)
“CM360” are Kyocera’s original material codes.