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Aerospace / Satellite Applications
See below for ceramic packages used in aerospace and satellite applications.
Standard Packages / Lids
High-Frequency / RF Device Packages, Lids, and Substrates
Ceramic Packages for Power Transistors
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Low Electrical Loss
This page introduces LTCC materials with excellent high-frequency characteristics, along with Kyocera's design support services.
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Ceramic Package Miniaturization
Miniaturization is achieved through the development of high-strength materials and improvements in processing technologies.
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Hermetic Sealing
This page provides an overview of hermetic sealing technologies for protecting components from the external environments.
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High Thermally Conductive Ceramics
By using materials with high thermal conductivity, heat generated by components is effectively dissipated.
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Matching Coefficients of Thermal Expansion
By considering the thermal expansion coefficient matching between different materials, we contribute to improved device reliability and stress relief for components.
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