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Ceramic Packages for Power Transistors

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Kyocera creates high-performance power-transistor packages by bonding ceramics to metals using metallization and brazing technologies.

These high-reliability packages incorporate alumina ceramic brazed with Cu-cored alloy pins/leads and a metal heat spreader at the bottom.

Features

High Voltage

Hermetic Sealing

Superior Thermal Conductivity

Kyocera's ceramic power-transistor packages support high-voltage and/or high-current applications, with superior heat dissipation using higher thermal conductivity materials. An optional metal seal ring ensures hermetic sealing for higher reliability by preventing moisture and dust from entering the device.

TO-254 PKG / TO-257 PKG

TF-TO254 PKG

TF-TO3P PKG

Package	TO-257 PKG	TO-254 PKG	TF-TO254 PKG	TF-TO3P PKG
Drawing Number	PGMR-A6142	PGMR-A6140	GMR-A9455-A	SGMR-B4385
Plating Specification	Ni + Au	Ni + Au	Ni	Ni + Au
Heat Spreader	KYCM^® (260W/mK)	KYCM^® (260W/mK)	KYCM^® (260W/mK)	Cu-W (175W/mK)
Pin/Lead Material	Alloy 50 (Cu Cored)	Alloy 50 (Cu Cored)	Alloy 50 (Cu Cored)	Cu
Pin/Lead Current Capacity	15A max.	20A max.	20A max.	50A max.
Dielectric Withstand Voltage (HIPOT)	1.0kV min.	1.0kV min.	1.0kV min.	1.2kV min.
High Temperature Storage Test	300℃ 1,000 hours	300℃ 1,000 hours	200℃ 1,000 hours	300℃ 1,000 hours
Temperature Cycle Test	-65℃ ～ +175℃ 1,000 cycles	-65℃ ～ +175℃ 1,000 cycles	-65℃ ～ +175℃ 1,000 cycles	-65℃ ～ +175℃ 1,000 cycles

With the cooperation of Osaka University　(TF-TO254 PKG, TF-TO3P PKG)

Remarks:
1. Testing was conducted on alumina ceramic (Kyocera A440).
2. Plating options: Ni plating only or Ni+Au plating.
3. "KYCM" is a registered trademark of Kyocera Corporation.
4. Pin/Lead current capacity is the value when the pin/lead temperature reaches 80℃.
5. The High Temperature Storage Test and Temperature Cycle Test were conducted by Kyocera. Pass/Fail criteria: visual and HIPOT (High Potential Test).