Millimeter-Wave (30~100GHz) Packages
Advanced packages for RF devices, Millimeter-Wave Power Amplifiers, and Monolithic Microwave ICs (MMICs) incorporate Kyocera's multilayer ceramics and metal brazing technologies, which facilitate 3D circuitry, and enable metals and ceramics to be brazed together. Kyocera designs optimal Input/Output transitions for high-speed, wide-band mobile phone base stations and other wireless networks. Because high-power devices generate heat, Kyocera designs solutions with thermally conductive metal heat spreaders brazed directly onto the ceramic packages.
Features
Surface Mount Millimeter-Wave Packages
Kyocera provides miniaturized surface-mount packages for RF devices such as millimeter-wave MMICs. The package’s I/O terminals are optimized for millimeter-wave frequency ranges. To efficiently dissipate heat, a CuMo heat spreader with high thermal conductivity is brazed onto the package bottom.
For higher-power devices, Kyocera’s RF-KLCC package offers a Cu heat spreader with heat dissipation performance even better than CuMo solutions.
High Frequency Characteristics
Package with Waveguide Conversion Port
When a waveguide I/O interface is required, Kyocera offers ceramic packages with waveguide converter ports that can transmit signals from MMICs and other RF devices at lower losses. Additionally, Kyocera’s CuMo heat spreader with high thermal conductivity is brazed to the package to dissipate heat efficiently.
E-Band (71~86Hz) Waveguide Converter Port
Waveguide_Converter_Port2.jpg)
Waveguide_Converter_Port3.jpg)
Package with High-Frequency Coaxial Connector
For coaxial cable-I/O interface, Kyocera offers packages that enable low-loss transition from RF devices, including millimeter-wave and MMICs. To dissipate heat efficiently, a CuMo heat spreader with high thermal conductivity is brazed to the bottom side of the metal package with ceramic feedthrough.
