1. Home
  2. Products
  3. Fine Ceramics(Advanced Ceramics)
  4. Catalogs
  5. Ceramic Components for Semiconductor Processing Catalog Overviews
Fine Ceramics(Advanced Ceramics)

Contribute to the development of high-functionality, lightweight, and high-precision technologyCeramic Components for Semiconductor Processing
Catalog Overviews

Pick Up 01

Fine ceramic components used in semiconductor manufacturing equipment

The performance of semiconductors continues to improve and their applications continue to expand. The various manufacturing equipment that produces them is required to respond to technological trends such as miniaturization of wiring and multi-layering, all while achieving higher productivity. For this reason, lithography equipment components require high-precision parts made of lightweight and rigid materials, and etching and deposition equipment components require plasma resistance and low particles. Also, they may require heat resistance of 600 degree C or higher or low dielectric loss. All of these demands have led to an increased use of ceramics. Kyocera’s Fine Ceramic products with high-precision and excellent mechanical properties are widely used in inspection equipment such as probers, wafer cutters, back grinders, and wafer transfer arms. In addition, sapphire is used for such applications as windows that require optical transparency, wafer carrier plates, wafer contact lift pins, and plasma introduction tubes.
Fine ceramic components used in semiconductor manufacturing equipment
Pick Up 02

Product Examples

Wafer Manufacturing Process

  • Alumina Wafer Polishing Plate / Turn Table
    Alumina Wafer Polishing Plate / Turn Table
  • Silicon Carbide Wafer Polishing Plate
    Silicon Carbide Wafer Polishing Plate
  • Pad Dresser
    Pad Dresser
  • Sapphire Carrier Plate
    Sapphire Carrier Plate

Device Manufacturing Process

  • Plasma Proof Dome
    Plasma Proof Dome
  • Plasma Proof Ring
    Plasma Proof Ring
  • End Effector
    End Effector
  • Chamber Window & Tube
    Chamber Window & Tube

Epoch-making Technologies

  • Metalized Products - Metal Assembly Technology
    Metalized Products - Metal Assembly Technology
  • Coating Technology
    Coating Technology

Index of Catalog

The catalog introduces the following material properties and product examples. Download the PDF to learn more.
  1. Technologies
    Design & Simulation Technology / Analysis Technology / Evaluation Technology
  2. Material Properties
    Material Characteristics Table
  3. Products
    [ Wafer Manufacturing Process ]
    Alumina Wafer Polishing Plate / Silicon Carbide Wafer Polishing Plate / Pad Dresser / Sapphire Carrier Plate

    [ Device Manufacturing Process ]
    Plasma Proof Dome / Plasma Proof Ring / Electro-Static Chuck / Heater / Vacuum Chuck / Nozzle / End Effector

    [ Epoch-making Technologies ]
    USM Stage - Assembly Technology / Metalized Products - Metal Assembly Technology / Coating Technology / Material Development Technology
Ceramic Components for Semiconductor Processing
Ceramic Components for Semiconductor Processing