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Fine Ceramics(Advanced Ceramics)

50% size reduction and 1.6 times higher voltage resistance compared to conventional ceramic (based on Kyocera simulation).

Alumina ceramics, which have high dielectric resistance characteristics, are widely used in high-voltage devices.
Kyocera has developed the new material AH100A with improved creeping dielectric resistance performance.
AH100A has 1.6 times higher creeping dielectric resistance and 1.2 times higher penetration dielectric resistance compared to conventional ceramics. This makes it possible to reduce high-voltage conditioning time and miniaturize terminals.

Features

  • Significantly improved creeping dielectric resistance and penetration dielectric resistance in vacuum atmosphere.
  • Significant reduction of high voltage conditioning time
  • 50% size reduction compared to conventional alumina (based on Kyocera simulation)

Creeping Dielectric Resistance

Creeping Dielectric Resistance
Measurement Conditions

Creeping dielectric resistance distance: 2 mm
Measurement atmosphere: 10 Pa or less
Other measurement conditions of Kyocera

Penetration Dielectric Resistance

Penetration Dielectric Resistance
Measurement Conditions

2mm thickness
Other measurement conditions of Kyocera

Conditioning Time

Conditioning Time
Measurement Conditions

Pressure: 10-3 Pa or less
Boost Voltage: 1kV/min.
When flashover occurs, the voltage rises again from 0 volts

Image of New Compact Design

Image of New Compact Design
External Volume: 50% reduction
Weight: 55% less

Material Data Comparison

Material
Material Code
High Voltage-resistant Alumina Ceramics (Conventional) Alumina
AH100A AO479O
Electrical Characteristics Attained Electric Field Strength MV/m 14.1(ave.) 8.4(ave.)
Penetration Dielectric Resistance MV/m 24 19
Volume Resistivity 20℃ Ω・cm ≧1014 >1014
Dielectric Constant (1MHz) - 10.2 9.9
Dielectric Loss Angle (1MHz) (x 10-4) <1 2
Mechanical Characteristics Flexural Strength (3-point Bending) MPa 330 310
Young's Modulus of Elasticity GPa 380 360
Poisson's Ratio - 0.25 0.23
Fracture Toughness (SEPB) MPa・m1/2 5 3~4
Thermal Characteristics Thermal Conductivity 20℃ W/(m・K) 24 29
Coefficient of Linear Thermal Expansion (RT-800℃) × 10-6/K 8.2 8.0

Values are based on typical material properties and
may vary according to product configuration and manufacturing process.