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Substrates for Power Modules
High-strength substrates compatible with the direct bonding of copper sheets are suitable for a wide range of power module applications.
Kyocera manufactures high-strength substrate materials for power module applications. Available materials are Alumina (A476T, A477A) and Zirconia-toughened Alumina (AZ211), depending on your requirements for performance and cost.
- Property :
- High Strength
- Low Thermal Expansion
- Insulation Property
Product Data
| Material | Alumina,Alumina-Zirconia |
|---|---|
| Shape | Substrate |
Features
Size & Characteristics
*Values are typical data from test pieces.
Applications
- Power Module Parts
