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Heat Dissipation Structure Ceramic Substrates
Monolithic ceramic structure with no bonding material for long-term reliability.
- Cooling or heat exchanging components made of light weight ceramic with low heat capacity provide a more efficient, energy saving system compared to metal.
- Design possibility for thin wall or complex structure.
- Long term, efficient cooling and temperature control.
- Low maintenance cost due to superior chemical durability.
- Applicational exploitation other than cooling or temperature control.
- Property :
- Design flexibility
- High-Temperature Durability
- Chemical Resistance
- Bonding Technology
- High Efficiency Heat Exchange
Product Data
| Material | Alumina, Silicon Carbide |
|---|
Features
Material Characteristics
Applications
- Heat exchanger components
- Manifolds
- Micro reactors
- Thermal insulation components
