Electronic device miniaturization
Case study: Kyocera’s Fine Ceramic technology solutions contribute to electronic device miniaturization by reducing the height and size of a gyro sensor cap
- Insulation / Semiconductivity
Contribution to extending the life of the guide at high temperature
Case study: Fine Ceramics extend the life of hot-dip galvanization process (500℃) guides used for steel wire production
- High-Temperature Strength
Achieving High Precision and Energy Efficiency
Case study: Improving air slide energy efficiency and precision through the use of Fine Ceramics
- Specific Gravity
Dramatic increase in life expectancy of nozzles leads to reduced down time of equipment
Case study: A case study of improvement in abrasion resistance at an inner and outer temperature difference of 800℃
- Heat Shock Resistance
Directly joining ceramics without the use of adhesive
Case study: Improving the chemical resistance of phototransmissive windows for measuring chemical concentrations.
- Chemical Resistance
Ceramic guide rollers
Case study: Improving the quality of metal wire, and achieving a lower frequency of replacing rollers.
Use ceramics for hot-pressing machine holder
Case study: Example of improving dimensional accuracy with a zirconia plate of low thermal expansion and thickness tolerance of +/-10 micrometers.
- Coefficient of Thermal Expansion
- Thermal Conductivity