In general, it is difficult to identify the causes of and formulate counter measures for electromagnetic Interference (EMI) in an actual device. We optimize the placement/wiring and return path of power through differential mode emission analysis and common mode emission analysis at the design stage in order to minimize EMI. We also manage analysis of electrostatic discharge (ESD) and thermal analysis.
We manage the EMI level of the board by picking out signals which have high-level noise, and optimizing component placement and routing. This can also maintain margin operation of the circuit.
We construct models based on actual design. Then simulate the discharge noise from outside boards, looking over capacitors effects.
We make the thermal distribution visible with thermal components on printed boards. Analysis of thermal distributions on boards including thermal conductive properties of printed boards and thermal distribution with chassis are available.
Optimizing component placement, and optimizing beta pattern which function as heatsink and number of vias on board are available.