Organic Packages / Printed Wiring Boards

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FC-CSP Substrates

FC-CSP Substrates

In recent years, IC packages have become necessary to meet the market needs of small and thin substrates required for digital handset equipment.
Kyocera has been enhancing and improving SLC technologies to respond to the market demand for thin and small substrates.


  • Applicable up to 35µm pitch for flip-chip assembly (peripheral)
  • Thin build-up laminate for SiP applications (0.3mmt for 1-2-1)
  • Applicable environmentally-friendly products (Halogen-free, Lead-free)
  • Various surface finish options are available
    (Au plating, Lead-free solder coating, OSP, etc.)


Cross Section (1-2-1)


Specifications are subject to change without notice due to continual improvements in materials and manufacturing processes.

Please feel free to contact us for further information.


  • FC-CSP for mobile phones and smartphones
  • FC-CSP for digital cameras

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