Organic Packages / Printed Wiring Boards

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Module Substates

Thin Type Module Substrates
Our base material is of an optimum type and thinness to meet the requirements of module-mounted products for compactness and high functionality and to enable the micro-fabrication development necessary for the high-density wiring/land size reduction required by such boards.
Embedded-Component PWBs
In response to demands for size/weight reduction and increased speed and function of assembled products such as mobile devices and functional modules, our component-embedded boards allow for a reduction of mounting space and the enhancement of electric properties.

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