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Organic Packages / Printed Wiring Boards

Module Substates

Thin Type Module Substrates

Our base material is of an optimum type and thinness to meet the requirements of module-mounted products for compactness and high functionality and to enable the micro-fabrication development necessary for the high-density wiring/land size reduction required by such boards.

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Organic Package: Build-up Structure FC-BGA; FC-CSP Substrates

Module Substates: Thin Type Module Substrates

Printed Wiring Boards: AnyLayer PWBs

Board Design

Simulation: Transmission Line Simulation; Power Supply Noise Simulation; EMI / ESD / Thermal Simulation

One-stop Solution: Development Flow Chart; List of Technologies We Can Handle; Case Example

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