Thin Type Module Substrates
Using our strong technical capabilities, we have developed cutting-edge technology
Our base material is of an optimum type and thinness to meet the requirements of module-mounted products for compactness and high functionality and to enable the micro-fabrication development necessary for the high-density wiring/land size reduction required by such boards.
Features
- Board thickness 0.25mm (6 layered) and 0.18mm (4 layered) achieved by the adoption of ultra- thin base material/prepreg
- Bare chip of 250-150µm ultra-narrow pitch achieved
- High-reliability thinner board suited for any type of layer connection structure
- Plating technology creates an optimum product for side connection on module
Specifications
| Item | Specification | |
|---|---|---|
| (Maximum build-up layers) | 4 | |
| Line/space (Min) | Inner layer | 35/35μm |
| Outer Layer | 40/40μm | |
| Via diameter (hole/land) | 75/110μm (60/90μm) | |
| Core thickness (Min.) | 0.03mm | |
| Thickness between the insulating layer (Min.) | 0.025mm | |
| Total board thickness (Min.) | 1-2-1 | 0.18mm |
| 2-2-2 | 0.25mm | |
Structure
Applications
- Camera modules
- Bluetooth modules
- Wireless modules
- Power amp modules
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