Organic Packages / Printed Wiring Boards

Thin Type Module Substrates

Using our strong technical capabilities, we have developed cutting-edge technology

Our base material is of an optimum type and thinness to meet the requirements of module-mounted products for compactness and high functionality and to enable the micro-fabrication development necessary for the high-density wiring/land size reduction required by such boards.

Features

Board thickness 0.25mm (6 layered) and 0.18mm (4 layered) achieved by the adoption of ultra- thin base material/prepreg
Bare chip of 250-150µm ultra-narrow pitch achieved
High-reliability thinner board suited for any type of layer connection structure
Plating technology creates an optimum product for side connection on module

Specifications

Item		Specification
(Maximum build-up layers)		4
Line/space (Min)	Inner layer	35/35μm
Line/space (Min)	Outer Layer	40/40μm
Via diameter (hole/land)		75/110μm (60/90μm)
Core thickness (Min.)		0.03mm
Thickness between the insulating layer (Min.)		0.025mm
Total board thickness (Min.)	1-2-1	0.18mm
Total board thickness (Min.)	2-2-2	0.25mm

Structure

Applications

Camera modules
Bluetooth modules
Wireless modules
Power amp modules

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