Our base material is of an optimum type and thinness to meet the requirements of module-mounted products for compactness and high functionality and to enable the micro-fabrication development necessary for the high-density wiring/land size reduction required by such boards.
|(Maximum build-up layers)||4|
|Line/space (Min)||Inner layer||35/35μm|
|Via diameter (hole/land)||75/110μm (60/90μm)|
|Core thickness (Min.)||0.03mm|
|Thickness between the insulating layer (Min.)||0.025mm|
|Total board thickness (Min.)||1-2-1||0.18mm|