We design printed-wiring boards featuring excellent cost performance and high quality based on our industry’s top class high-density wiring board technology and using our printed circuit design expertise cultivated through our many years of operation. When existing boards need revision, we also focus on reduction in total cost and realization of reduction of the development period through value engineering.
Note: Allegro and Cadence are registered trademarks or trademarks of Cadence Design Systems, Inc., USA.
Zuken is a registered trademark or trademark of Zuken Inc. CADVANCE is a registered trademark or trademark of YDC Corp. Mentor and Mentor Graphics are registered trademarks or trademarks of Mentor Graphics Corporation, USA.
|Memory interface||DDR2 (~1Gbps) / DDR3 & DDR3L (~1.6Gbps) / LPDDR4 (3.2Gbps)|
|Communication among digital information equipment||HDMI / USB2.0 / USB3.0 / DVI / HD-SDI / MIPI-DSI|
|High-speed Signal transmission Devices||PCI-ExpressGen3 / S-ATA (Gen3) / XAUI / RAPID-IO / ROCKET-IO / XFP / SFP+|
|Embedded boards||FPGA, ARM microcomputers (such as i.MX6), Renesas microcomputers|
|Mobile products / Consumer imaging products||DSC / PC / TV / Blu-ray / Set Top Box / PDA / etc.|
|Car information system (CIS)||Navigation, audio, display, etc.|
|Semi-conductor equipment||BOST(Built-out self-test) / Various testers, etc.|
|Medical equipment||Bed sensors, wireless sensors, foot pressure sensors and others, etc.|
|Others||Copy machines, Printers, High-speed Cameras, Various broadcast equipment, etc.|